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Circuit Assembly Materials

Surface Mount Adhesives

PRODUCT
DESCRIPTION
MA-420 Snap Cure, High Speed Dispensable and Printable

Chip-on-Board Encapsulants

PRODUCT
DESCRIPTION
ME-430 High Profile Glob Top Encapsulant

ME-455

High Purity, Fast Cure Cavity Fill Encapsulant

ME-455-1 Low CTE Epoxy
ME-456 High Purity, Fast Cure Dam Encapsulant
MS-330 One Component, Heat Curing Silicone Encapsulant

Consumer Grade Glob-Top Encapsulants

PRODUCT
DESCRIPTION
Circalok EP-729 One Component, Fast Curing Epoxy
Circalok EP-937 One Component, Very Fast Curing Epoxy
Circalok EP-939 One Component, Extra Fast Curing Epoxy

Silver-Filled Adhesives

PRODUCT
DESCRIPTION
MD-110 Electrically Conductive Die Attach Adhesive
MD-130 Electrically Insulating Die Attach Adhesive
MD-140 Silver-Filled Die Attach Adhesive
MD-150 Silver-Filled Conductive Adhesive
MD-200 Two Component, Electrically Conductive Die Attach Adhesive

Underfill Encapsulants

PRODUCT
DESCRIPTION
ME-525 Flip Chip Underfill Encapsulant for High End Ceramic and Automotive Applications
ME-531 Flip Chip Underfill Encapsulant for Consumer and PCB Applications
ME-541 Anhydride-Free, High Purity, Semiconductor Grade Epoxy Underfill
ME-542 Anhydride-Free, Thermally Conductive, Semiconductor Grade Epoxy Underfill
ME-580 Underfill Encapsulant
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