| Circalok
6009 A/B |
Low Viscosity, Various Colors Epoxy Encapsulant,
UL94V-0 |
| Circalok
6031 |
Semi-Rigid, High Temperature, Excellent Arc Track Resistance
Epoxy Encapsulant |
| Circalok
6703 |
Thermally Conductive Silicone, UL94V-0 |
| Circalok
6715 |
Condensed Cure, No Stress, No Inhibition Silicone Encapsulant
|
| LS213-9
|
One Component, Unfilled, Superior Moisture Resistance
Epoxy Encapsulant |
| SC-102
|
Unfilled, Repairable, Excellent Thermal Shock Resistance
Silicone Encapsulant |
| SC-300M
|
Electronic Grade Silicone Gel Encapsulant |
| SC-303
|
High Thermally Conducte Encapsulating System, UL94V-0 |
| SC-309
|
Thermally Conductive Silicone Encapsulating System, UL94V-0
|
| SC-2002HV UV |
One Component, Low Temperature Cure Silicone Conformal Coating
|
| UR-312
|
Microelectronic Grade, Clear, Low Modulus Urethane Encapsulating
Gel |
| UR-322
|
Two Component, Room Temperature Curing Urethane Potting Compound |
| UR-325
|
Black, Hydrolytic and Elevated Temperature Stable Encapsulation
System |
| UR-329 |
Low Modulus, Urethane Potting/Encapsulating Compound |
| UR-340
|
Flexible, Low Viscosity Urethane Encapsulant |