| 3501 |
6/1 silver palladium ratio for low cost, moderate solder leach resistance. |
| 3502 |
9/1 silver palladium ratio for cost sensitive applications while retaining moderate solder leach properties. |
| 3503 |
2.1/1 silver palladium ratio for superior migration and solder leach resistance of the silver palladium group. |
| 3504 |
3/1 silver palladium ratio. A high performance conductor retaining solderability after overglaze profiles. |
| 3505 |
4/1 silver palladium ratio. A moderate cost/performance product for resistor networks. |
| 3506 |
10/1 silver palladium ratio. A low cost conductor for resistor network and chip resistor applications. Very rapid solder wetting. |
| 3507 |
12/1 silver palladium ratio for cost sensitive product applications. Exhibits rapid solder wetting characteristics. |
| 3511 |
Low cost palladium silver conductor for multilayer applications. |
| 3524 |
Silver conductor composition for nickel barrier plating applications. |
| 3524D |
Dippable version of 3524, designed for a reduced peak firing temperature ranging between 600-650°C. |
| 3540 |
Low cost platinum silver conductor employing a mixed bond system. |
| 3541 |
Similar to 3540 but exhibits improved silver migration resistance. Higher platinum content than 3540. |
| 3542 |
Platinum silver conductor with increased platinum content for improved solder leach resistance. |
| 3543 |
High performance platinum silver conductor for maximum solder leach resistance. |
3550
3551 |
Mixed bond platinum palladium silver conductor designed for high solder leach resistance applications. |
3552
3553 |
Mixed bond platinum palladium silver conductors designed for the most demanding solder leach resistance applications. |
| 3571 |
Mixed bond, high performance silver conductor for microwave and RF circuitry applications. Fired films exhibit a very dense, highly conductive surface. |
| 1130C |
Low cost platinum silver conductor. Fires at 850-925°C onto alumina and BeO substrates with excellent adhesion. |
| 1131K |
Electro Oxide platinum silver composition for dotting Cerdip cavities. Excellent settling properties for dotting applications. |
| 1139 |
Palladium silver version of 1131K for dotting Cerdip cavities. |