Thermal Management Materials
Thermal Adhesives
Several products offering high thermal conductivity and superior adhesion.
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Circalok™ 6037 A/Circalok 6252 B |
1.1 W/mK thermally conductive, room temperature cure, two-component epoxy adhesive |
|
MT-125 |
2.35 W/mK thermally conductive, rapid cure adhesive for TIM2 applications |
| MT-220 |
4.2 W/mK thermally conductive, one-component, silicone-hybrid adhesive for aluminum to laminate TIM2 applications |
| MT-315 |
11.3 W/mK thermally conductive, silver-filled adhesive |
| MT-322 |
1.5 W/mK thermally conductive, oxide-filled adhesive |
Gelease® Thermal Gels
| Gelease MG-100 |
2.1 W/mK thermally conductive, electrically insulative silicone gel interface material |
|
Gelease MG-100 Application Note |
Thermally conductive silicone gel |
| Gelease MG-121 |
2.3 W/mK thermally conductive, thin bondline, silicone gel interface material with improved HAST performance |
| Gelease MG-121 Application Note |
Thin bondline, thermally conductive silicone gel |
| Gelease MG-122 |
2.8 W/mK thermally conductive silicone gel interface material with good HAST performance |
| Gelease MG-133 |
3.8 W/mK thermally conductive silicone gel |
| Gelease MG-200 |
3.0 W/mK thermally conductive, low temperature cure, two-component silicone gel |
Thermal Greases
Microelectronics-grade, high temperature resistant greases offering very high thermal conductivity and easy dispensability.
| TC-208 |
1.2 W/mK thermally conductive, water cleanable, non-silicone grease compound |
| TC-228 |
1.1 W/mK thermally conductive, high temperature resistant, alcohol cleanable, non-silicone grease compound |
| TC-405 |
5.2 W/mK thermally conductive, stencil printable, silicone grease compound |
| TC-426 |
6.0 W/mK thermally conductive, solvent-free, silicone grease compound |
| TC-501 |
8.0 W/mK thermally conductive, solvent-free, no pump-out silicone grease compound |