Industry-Leading Electronics Company Qualifies LORD Corporation Die Attach Adhesive for Light Emitting Diode (LED) Applications

Customer
One of Japan’s LED manufacturers.

Challenge
In order to implement new technology for their high-intensity LED applications, this customer needed an improved thermally conductive die attach adhesive with excellent adhesion to their new die substrate combination, as well as specific rheology to allow high-speed dispensing of adhesive dots small enough to bond the 0.1 mm² (=280 micron x 280 micron actually).

Solution
Combining LORD Corporation’s existing silver-filled adhesive technology with their knowledge of dispensing technology and rheology resulted in a new die attach adhesive formulation with superior adhesion, moderate thermal conductivity and excellent dispensing characteristics. The solution, MD-160, offers excellent application characteristics using syringe dispense or pin transfer equipment.

Results
LORD Corporation responded to a short deadline by quickly developing a material that met all of the global customer’s requirements. In addition, extensive material performance and application data were generated that allowed the customer to expedite their qualification process and implementation into mass production.

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