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LORD Develops State-of-the-Art Thermal Interface Material to Dissipate Heat from High-Powered Computer Processors

Customer
A leading-edge silicon fabricator and packaging subcontractor for high-performance microprocessors.

Challenge
Highly-efficient removal of heat from the microprocessor was needed to maximize processor performance in the customer’s high-end server applications. A thermal interface material with high thermal conductivity, low thermal resistance and high reliability was needed to provide an efficient path for heat to escape from the processor package.

Solution
LORD Corporation, working closely with the customer’s packaging engineers, provided a custom-designed, silver-filled epoxy formulation. This patented composition functions as both a thermal interface material that transfers heat from the processor to the external environment and an adhesive that bonds the heat spreader assembly to the processor package.

Results
LORD Corporation’s solution provided the combination of high thermal conductivity, low interfacial thermal resistance and reliability needed for the customer to meet their performance targets on successive versions of their high-performance microprocessors.

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