Gold Bearing Conductor Compositions
We offer a complete series of gold bearing materials for high reliability applications such as aluminum and gold wire bonding, gold/tin solder paste, Cerdip cavity dotting, and fine line etching.
| 3610 |
Multipurpose, mixed bond gold composition designed for either gold or aluminum wire bonding applications. |
| 3610B |
Mixed bond gold conductor for aluminum wire bonding applications. Superior aging resistance at 300°C and 150°C for 1 mil aluminum wire. |
| 3612 |
Mixed bond gold composition for multilayer or gold wire bonding applications. |
| 3612B |
Thin print version of 3612 optimized for inner layer and automatic gold wire bonding applications. |
| 3612V |
Gold conductor designed for via fill applications in multilayer circuits. |
| 3614 |
Thin print, mixed bond gold composition for multilayer and gold wire bonding applications requiring superior adhesion. |
| 3615 |
Mixed bond platinum gold composition. Excellent solder wetting using either R or RMA fluxes. |
| 3616 |
Lower resistivity version of 3615. |
| 3692 |
Gold composition for dotting Cerdip cavities. Excellent settling characteristics for automated dotting applications. |
| 3950-R |
Gold tin solder paste for high reliability applications. |
| 6980B |
Electro Oxide, blanket coat gold composition. Can be etched with potassium iodide-iodine. |
| 6990-7 |
Electro Oxide, fritless gold composition for power hybrid applications. Excellent adhesion to BeO substrates. |