LORD Electronic Materials
Spending too much on underfill encapsulants?
Introducing LORD® ME-555 UNDERFILL ENCAPSULANT, your low-cost solution for flip chip devices.
LORD ME-555 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.
LORD ME-555 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
features & benefits
self-filleting:
Provides surface tension and viscosity flow properties to achieve full coverage without producing bulky fillet on top of the device.
rapid flow:
Formulated to flow consistently without voids while maintaining a fast flow rate; can be used under small dies and devices with stand-off heights above 25 micron.
good adhesion:
Provides good adhesion to laminate, ceramic, solder mask and metal surfaces.
low coefficient of thermal expansion:
Minimizes the possibility of cracking during temperature cycling (-40 to +125°C); provides excellent thermal shock performance.
device reliability:
Provides high Tg and high fracture toughness, reducing the amount of thermally induced stress placed on the solder interconnects.
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