Partnership Results in Optimal Design for Today and Tomorrow
(03/09/2010)
In today’s microelectronics arena, small and cool are essential. To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered computer processors, LORD worked with a customer’s packaging engineers to develop a custom-designed silver-filled epoxy formulation. The resulting patented composition functions as both a thermal interface material that transfers heat from the processor to the external environment and an adhesive that bonds the heat spreader assembly to the processor package. Through a targeted partnership, the customer met their design objectives as well as performance targets on successive versions of their high-performance microprocessors.
LORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the ...
To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered com...
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