Partnership Results in Optimal Design for Today and Tomorrow
In today’s microelectronics arena, small and cool are essential. To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered computer processors, LORD worked with a customer’s packaging engineers to develop a custom-designed silver-filled epoxy formulation. The resulting patented composition functions as both a thermal interface material that transfers heat from the processor to the external environment and an adhesive that bonds the heat spreader assembly to the processor package. Through a targeted partnership, the customer met their design objectives as well as performance targets on successive versions of their high-performance microprocessors.