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We believe in the worth and dignity of each individual and in the need to provide an environment which promotes individual and team development as demonstrated by continuous improvement, leading to external and internal customer satisfaction.

Partnership Results in Optimal Design for Today and Tomorrow

(03/09/2010)

In today’s microelectronics arena, small and cool are essential. To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered computer processors, LORD worked with a customer’s packaging engineers to develop a custom-designed silver-filled epoxy formulation. The resulting patented composition functions as both a thermal interface material that transfers heat from the processor to the external environment and an adhesive that bonds the heat spreader assembly to the processor package. Through a targeted partnership, the customer met their design objectives as well as performance targets on successive versions of their high-performance microprocessors.

Electronic Materials in the News

LORD Corporation Develops New Flame-Retardant Urethane ...

Thermoset UR-288 flame retardant urethane encapsulantLORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the ...

LORD Corporation Announces First Recipient for Aerospac...

The first recipient of the Distributor of the Year Award for its Aerospace & Defense Business Unit has been announced.

Partnership Results in Optimal Design for Today and Tom...

To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered com...
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