LORD Corporation’s Larry Wang to speak at International Microelectronics and Packaging Society Symposium
(04/20/2012)
Larry Wang, Ph.D., staff scientist, Electronic Materials Research and Development at LORD Corporation, will present a paper at the International Microelectronics and Packaging Society (IMAPS) 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging.
The paper will be presented on May 22 at Dearborn Inn in Dearborn, Mich. at 4:45 p.m. Wang's paper is titled: "Cooling from Down Under - Thermally Conductive Underfill."
In response to the need for protection and heat dissipation of flip chip devices in confined spaces where Thermal Interface Material (TIM) and heat sink is impractical, LORD developed a new class of thermally conductive underfills. This paper describes the key challenges in developing underfill technologies imposed by package geometrics and performance requirements, and discusses the development of a non-anhydride underfill with low viscosity, small particle size filler, high thermal conductivity and reliability. The results will be presented on the underfill material characterization, underfilling process parameter and flip chip device reliability.
Wang is responsible for the development and commercialization of new materials for the electronics market. With expertise in various areas including conductive materials, adhesives, underfills, potting and encapsulants, he also leads technical support to Marketing and Sales for the LORD electronics business. Having worked for LORD Corporation for 11 years, Wang has more than 20 years of combined industrial experience focused on adhesives, coatings and potting encapsulants for the electronics industry. Wang earned his Ph.D. in polymer science from Peking University.
For more information or to register for the 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, please visit www.imaps.org/automotive.
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