New Thermally Conductive Silicone Encapsulant Announced
Designed for encapsulation applications where high heat dissipation is required, LORD SC-305 is a two-component silicone system. Ideally suited for LED lighting power supply encapsulation, LORD SC-305 can be room temperature or heat cured for maximum adhesion. Benefits of the encapsulant include low stress, high thermal conductivity and superior environmental resistance.
Composed of an addition-curing polymer that will not depolymerize when heated in confined spaces, the silicone encapsulant is a durable solution. LORD SC-305 also meets the requirements of UL 94 V-O, providing excellent flame retardancy. Further, the three-step application process involving mixing, applying and curing is user-friendly, making LORD SC-305 an ideal solution for encapsulation.
According to Adam Conklin, Global Market Manager at LORD Corporation, LORD SC-305 was developed to meet the needs of customers requiring a high performance thermally conductive encapsulant at a cost that allows them to be competitive in their respective industries. It allows manufacturers of electronic components to address the continued pressure to reduce costs commonly encountered in the industry, he said, without sacrificing performance.
"LORD SC-305 builds on a long history of innovation and technical leadership in silicone, urethane and epoxy encapsulant formulation at LORD," said Conklin. "We have expanded our encapsulant solution portfolio by developing a cost-effective, thermally conductive encapsulant suitable for demanding applications including power supplies and control modules. In addition,
LORD SC-305 represents the first product developed and manufactured by our Technology, Operations and Sales and Marketing teams based in Shanghai, China. LORD China and the broader Asia-Pacific team will continue to be a source of innovation in electronic materials in the coming years."
More information on LORD SC-305 can be found http://www.lord.com/Products-and-Solutions/Electronic-Materials/Product.xml/1730.