Staff Scientist Selected to Discuss Wafer-Level Packaging Study
The International Wafer-Level Packaging Conference (IWLPC) has invited Russell Stapleton, Ph.D., Staff Scientist, to present a paper he co-authored about wafer-level solder support materials.
The paper, titled “Reliability of 400mm Pitch WLCSP Assembles with Solder Supporting Material,” is co-authored by Stapleton, Jeff Schake of DEK USA Inc., Michael Meilunas of Universal Instruments Corporation, and Rex Anderson, Ph.D. of Amkor Technology. It details research regarding a wafer level solder supporting material that was jet dispensed. The jetting method proved to be a simplified method for quickly applying and evaluating wafer level protective materials in the laboratory setting.
Stapleton received his B.S. in Polymer Chemistry from Rochester Institute of Technology in 1999 and his Ph.D. in polymer science from the University of Akron in 2004. His background is in polymer synthesis, organometallics and kinetics. He has been with LORD Corporation’s Electronic Materials Technology group since 2004 and has authored several papers and patents in the area of electronic packaging adhesives and coatings.
The event will take place at the Santa Clara Marriott, located in Silicon Valley. Stapleton will be speaking at Session 13 on Friday, Oct. 30 from noon to 1 p.m. in the Exhibit Hall.