Larry Wang Presented at Electrical Manufacturing & Coil Winding Expo
(08/05/2011)
Larry Wang, Ph.D., staff scientist, Electronic Materials Research and Development, presented a paper at the 2011 Electrical Manufacturing and Coil Winding Expo.
The paper was presented on Sept. 21 at the Opryland Convention Center in Nashville, Tenn. at 12:30 p.m. Wang's paper was entitled: "Inherently Flexible Epoxy Encapsulant – New Alternative for Low-Stress Electronic Packaging."
The presentation provided an overview of low-stress electronic packaging and new encapsulation materials and solutions, such as flexible epoxy gels, to meet the need of protecting sensitive components in harsh environments. Results of physical and mechanical property testing, chemical and humidity exposure, and high-temperature exposure experiments were discussed. In today's marketplace, electronic component technology has been moving steadily towards high functionality, smaller size and complex designs. At the same time, components are being used in a wide variety of industries and integrated into new and more demanding applications than ever before. To meet these industry demands, LORD Corporation responded by developing a unique low-stress epoxy gel encapsulant – ES-100. This epoxy encapsulant provides an alternative option for customer applications with harsher demands such as resistance to high temperatures and chemicals.
For more information, please visit http://www.electricalmanufacturing.org.
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