By: Kimberly Kayler , Constructive Communication , 614-873-6706

(Cary, NC — 10/08/2008)

LORD Corporation — a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry — will host the International Microelectronics and Packaging Society (IMAPS) Carolinas Chapter on Oct. 22. The half-day event will include four presentations and a tour of LORD Corporation’s facility.

The event will begin with a lunch at noon and will be followed by four 30 minute presentations, with a tour given partway through the afternoon. Given by Scott Morris of RF Micro Devices, the first presentation will discuss “Conformal Shielding on Multichip Modules.” In the second presentation, George Sears, Manager of the Electronic Materials Product Development Group, LORD Corporation, will detail “Technology Innovations Applied to Wafer-Level Encapsulants and Thermal Interface Materials.” Chet Balut of DuPont Electronic Technologies will lead the third presentation on “Unique Dry Film Photoresist System for TSV Via Formation/Protection/Plating.” The final presentation of the day, “3D Packaging: Challenges and Opportunities,” will be given by Dr. David Seeger, Semiconductor Research Corporation-IBM.

“As an active participant in the electronics industry, we are pleased to host this chapter meeting to showcase our facility and encourage networking among the local electronics community,” said Jim Greig, North American Sales and Marketing Manager, Electronic Materials.

To register for the event, visit http://www.imaps.org/programs/carolinas08oct.htm. Online registration ends on Oct. 17. Cost to attend is $15 for IMAPS members, $25 for non-members and $5 for students. The event will be at LORD Corporation’s R & D Building at 111 Lord Drive in Cary, N.C.