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Electronic Materials


With more than 40 years of experience developing electrical potting compounds and encapsulation materials using epoxy, silicone and urethane polymer systems, we continue to develop custom potting and encapsulant solutions for demanding applications in a wide variety of industries including, automotive, medical, aerospace, telecommunications and industrial electronics. Typical applications for potting compounds and encapsulation materials include ignition coils, engine control modules, transmission control modules, sensors, power supplies, transformers and other critical electrical/electronic equipment.

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Circalok™ 6011B Hardener
Epoxy hardener specifically designed for use with Circalok™ 6006-HS epoxy resin....
Circalok™ 6007 Epoxy Resin
LORD Circalok™ 6007 resin is a ceramic-filled epoxy resin specifically formulated for use with Circalok or Thermoset hardeners to create a two-component system. This system is recommen...
Circalok™ 6008 Epoxy Resin
LORD Circalok™ 6008 resin is a filled epoxy resin formulated for use with Circalok or Thermoset hardeners to create a general purpose potting and encapsulation compound. This two-comp...
Circalok™ 6009
Circalok™ 6009 A/B is a two component epoxy resin system which has moderate thermal conductivity and low viscosity. Circalok™ 6009 A/B meets UL 94V-0 specification for flame reta...
Circalok™ 6013
Circalok™ 6013 is a high density, fast cure sound deadening, radiation-opaque lead-filled epoxy compound.

For further information on this material, please complete the Contac...
Circalok™ 6015
Circalok™ 6015 is a high density, fast cure, sound deadening, radiation-opaque epoxy compound.

For further information on this material, please complete the Contact Us form....
Circalok™ 6028/6029 Epoxy Encapsulant
LORD Circalok™ 6028/6029 encapsulant is a two-component epoxy system used for potting high voltage transformers, specifi cally units designed for high temperature service. Circalok 602...
Circalok™ 6035
Circalok™ 6035 A/B is a low viscosity, flame retardant, room temperature curing potting compound. Meets UL94V-0....
Circalok™ 6056
Circalok™ 6056 A/B is a black, two component, room temperature curing epoxy encapsulating compound featuring long pot life, convenient mix ratio and good dielectric properties....
Circalok™ 6059
LORD system Circalok™ 6059 A/B represents a technological breakthrough in epoxy chemistry providing exceptional flexibility to -50°C and superior tensile strengths at elevated temperatures. ...
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Electronic Materials in the News

LORD Corporation Develops New Flame-Retardant Urethane ...

Thermoset UR-288 flame retardant urethane encapsulantLORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the ...

LORD Corporation Announces First Recipient for Aerospac...

The first recipient of the Distributor of the Year Award for its Aerospace & Defense Business Unit has been announced.

Partnership Results in Optimal Design for Today and Tom...

To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered com...
Tradeshows & Events

Electric & Hybrid Vehicle Technology Expo

Novi, MI   Sep 16 - Sep 18

LORD Corporation will showcase thermally conductive potting and encapsulation technology solutions....

Air Medical Transport Conference (AMTC)

Nashville, Tennessee   Sep 22 - Sep 24

Weapons and Tactics Analysis Center (WEPTAC) Show

Phoenix, AZ   Oct 13 - Oct 17

International Elastomer Conference

Nashville, Tennessee   Oct 14 - Oct 16

The International Elastomer Conference is an opportunity for traditional rubber and polymer companies and associated industries to gather with product and equipment manufactur...

HOC C-130 Hercules Operators Confence

Atlanta, Georgia   Oct 19 - Oct 19


Atlanta, Georgia   Nov 04 - Nov 06

Fabtech is North America's largest metal forming, fabricating, welding and finishing event....

18th Annual Regional & Business Aviation Industry Suppliers Conference

Paradise Valley, Arizona   Nov 06 - Dec 08