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Circalok™ 6007
Circalok™ 6007 is the result of extensive research to develop a compound which combines outstanding adhesion with high electrical insulation, thermal conductivity, and non-burning properties. The product meets MIL T-27 Grade 5, Class V, MIL I-16923 Types C & D and UL non-burning requirements of 94V-O. Circalok™ 6007 is a low viscosity ceramic filled epoxy resin offering excellent heat transfer, high voltage insulation, low exotherm and negligible shrinkage. The product is recommended as a thermally conductive, thin glue line adhesive for bonding semiconductors to heat sinks and as a low viscosity potting and casting product for any application where thermal conductivity and non-burning properties are required.
Shelf Life
Shelf life is twelve months from date of shipment when stored in original, unopened container.
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