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Circalok™ 6037 Epoxy Resin
LORD Circalok™ 6037 epoxy resin is formulated for use with various Circalok hardeners to create a two-component epoxy system. The epoxy system is primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. Circalok 6037 resin can also be mixed with Circalok hardeners for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components.
Shelf Life
Shelf life is twelve months from date of manufacture when stored at 25°C in original, unopened container.
Features and Benefits
• Low Stress - exhibits low shrinkage and stress on components as it cures.
• Excellent Adhesion - provides a strong adhesion bond to a wide variety of substrates.
• Low Coefficient of Thermal Expansion - minimizes the possibility of cracking during severe temperature cycling.
To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered com...
LORD Corporation has sold its cermet thick film business to Heraeus Materials Technology LLC for an undisclosed amo...