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LORD Corporation

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Semiconductor Packaging and Circuit Assembly Products Electronics Blog

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Product Viscosity Mixed Viscosity Cure Time Thermal Conductivity Glass Transition Temperature (Tg) Technical Data Sheets MSDS (US)
Thermoset ME-430 Board Level Encapsulant 317,500 135 Download Download
Thermoset ME-455 Board Level Encapsulant 19,000 135 Download Download
Thermoset ME-456 Dam Encapsulant 900,000 - 1,500,000 135 Download Download
Thermoset ME-525 Underfill Encapsulant 6000 0.5 120 Download Download
Thermoset ME-531 Underfill Encapsulant 4000 0.5 140 Download Download
Thermoset ME-543 Underfill Encapsulant 21,000 1.2 135 Download
Thermoset ME-588 Underfill Encapsulant 13,000 139 Download
Thermoset TC-208 Thermally Conductive Grease 500,000 1.2 Download Download
Thermoset TC-228 Thermally Conductive Grease 350,000 1.1 Download Download
Thermoset TC-404 Thermally Conductive Grease 212,400, Shear Rate 5/sec
141,800, Shear Rate 10/sec
4.3 Download Download