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Semiconductor Packaging and Circuit Assembly Products Electronics Blog

Showing 1 - 10 of 31
31
Product Viscosity Mixed Viscosity Cure Time Thermal Conductivity Glass Transition Temperature (Tg) Technical Data Sheets MSDS (US)
Thermoset MD-130 Adhesive

60,000

0.42 140 Download
Thermoset MD-240 Conductive Adhesive

13,000

11 109 Download
Thermoset ME-430 Board Level Encapsulant

317,500

135 Download Download
Thermoset ME-456 Dam Encapsulant

900,000 - 1,500,000

135 Download Download
Thermoset ME-455 Board Level Encapsulant

19,000

135 Download Download
Thermoset ME-531 Underfill Encapsulant

4000

0.5 140 Download Download
Thermoset ME-543 Underfill Encapsulant 21,000 1.2 135 Download
Thermoset ME-588 Underfill Encapsulant 13,000 139 Download
Thermoset MT-125 Thermally Conductive Adhesive 100,000 2.35 123 Download Download
Circalok™ 6960 Conductive Adhesive 150,000 1.1 49 Download Download