Electronic Materials
Semiconductor Packaging/Circuit Assembly
We have developed a wide range of materials for semiconductor packaging and circuit assembly comprised of chip-on-board encapsulants, glob-top encapsulants, silver-filled conductive adhesives and capillary underfills. These materials have a strong track record in challenging microelectronic applications.



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LORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the ...