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Electronic Materials

Semiconductor Packaging/Circuit Assembly

We have developed a wide range of materials for semiconductor packaging and circuit assembly comprised of chip-on-board encapsulants, glob-top encapsulants, silver-filled conductive adhesives and capillary underfills. These materials have a strong track record in challenging microelectronic applications.

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Semiconductor Packaging / Circuit Assembly
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Thermoset® EP-937 Board Level Encapsulant
LORD Thermoset® EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards....
Thermoset® EP-939 Board Level Encapsulant
LORD Thermoset® EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards....
LORD® MA-420 Epoxy Adhesive
LORD® MA-420 adhesive is a one-component epoxy adhesive that provides snap cure for high-speed printed circuit board assembly. LORD MA-420 adhesive can be used for both high-speed...
Thermoset® MD-140 Conductive Adhesive
LORD Thermoset® MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as micro...
Thermoset® MD-150 Conductive Adhesive
LORD Thermoset® MD-150 silver-filled conductive adhesive offers excellent electrical and thermal conductivity. It is designed for use with automated dispensing, stamping and scree...
Thermoset® MD-161 Conductive Adhesive
LORD Thermoset® MD-161 conductive adhesive offers excellent electrical conductivity. It is designed for dispensing through small nozzles.
Thermoset MD-161 adhesive provides e...
Thermoset® ME-430 Board Level Encapsulant
LORD Thermoset® ME-430 encapsulant is a one-component, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and f...
Thermoset® ME-455 Board Level Encapsulant
LORD Thermoset® ME-455 encapsulant is a one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity ...
Thermoset® ME-456 Dam Encapsulant
Thermoset® ME-456 encapsulant is a one-component, semiconductor grade epoxy dam material designed for use in the encapsulation of wirebonded or flip chip devices where a dam is ne...
Thermoset® ME-531 Underfill Encapsulant
LORD Thermoset® ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce w...
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Electronic Materials in the News

Partnership Results in Optimal Design for Today and Tom...

To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered com...

LORD Corporation Sells Cermet Thick Film Business

LORD Corporation has sold its cermet thick film business to Heraeus Materials Technology LLC for an undisclosed amo...
Tradeshows & Events

ISA

Orlando, FL   Mar 21 - Mar 24

ISA's International Sign Expo is the ONE industry show you need to attend. Everyone in the sign industry will be there to exchange ideas and discover innovative solutions for ...

World of Modular

Orlando, FL   Mar 24 - Mar 26

World of Modular is the commercial modular building industry's largest event....

Offshore Technology Conference

Houston, TX   Apr 30 - May 03

Founded in 1969, the Offshore Technology Conference (OTC) is the world’s foremost event for the development of offshore resources in the fields of drilling, exploration, produ...

AHS Forum 68

Ft Worth, TX   May 01 - May 03

ASH Forum 68 is the biggest and best vertical flight technology conference in the world....

Del Mar Electronics Show

San Diego, CA   May 02 - May 03

The premier event for those who design, manufacture or test products....

AWS Weldmex

Mexico City, MX   May 02 - May 05

AWS Weldmex will feature three shows in one: AWS Weldmex, Metalform Mexico and Fabtech Mexico....

Electrical Manufacturing and Coil Winding Expo

Milwaukee, WI   May 09 - May 10

If you design, manufacture, use, sell, or provide production equipment or materials used in electric devices The ELECTRICAL MANUFACTURING & COIL WINDING EXPO 2012 is where you...

Windpower

Atlanta, GA   Jun 03 - Jun 06

The American Wind Energy Association's annual WINDPOWER Conference & Exhibition is recognized as one of the world's premier wind energy trade shows, bringing together attendee...

Solar Power International

Orlando, FL   Sep 10 - Sep 13

IMAPS

San Diego, CA   Sep 11 - Sep 13

IMAPS 2012 is the largest symposium related to the microelectronics packaging industry in the world...

ACS Rubber Expo

Cincinnati, OH   Oct 09 - Oct 11

The premier event for enhancing science, technology and business across the evolving elastomeric community....

Fabtech

Las Vegas, NV   Nov 12 - Nov 14

North America's largest metal forming, fabricating, welding and finishing event...

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