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Electronic Materials

Thermal Management

Our thermal management materials include high performance thermally conductive adhesives, greases and gels. We transformed the thermal management market in the late 1990s with the introduction of GeleaseTM thermally conductive gels. Since then, we have continued innovating in the thermal management arena by introducing several novel solutions including a world-class highly thermally conductive adhesive (MT-315) and a new no pump-out thermally conductive grease that eliminates pump-out without the required cure step of a gel (TC-501).

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Thermal Management
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Circalok™ 6007 Epoxy Resin
LORD Circalok™ 6007 resin is a ceramic-filled epoxy resin specifically formulated for use with Circalok or Thermoset hardeners to create a two-component system. This system is recommen...
Circalok™ 6037 Epoxy Resin
LORD Circalok™ 6037 epoxy resin is formulated for use with various Circalok hardeners to create a two-component epoxy system. The epoxy system is primarily used by the semiconductor in...
Circalok™ 6151 Epoxy Adhesive
LORD Circalok™ 6151 adhesive is a one-component, aluminum-filled epoxy adhesive designed for use as a thermal interface adhesive for heat sink attachment and other applications requiri...
Circalok™ 6702
Circalok™ 6702 A/B is a high density, thermally conductive, primerless silicone rubber used to encapsulate sensitive electronic modules....
Circalok™ 6703 Thermally Conductive Silicone Encapsulant
LORD Circalok™ 6703 thermally conductive silicone encapsulant is a two-component system designed to provide thermal conductivity for encapsulating densely packed power units....
Circalok™ 6710 Silcone Resin
LORD Circalok™ 6710 silicone resin is formulated for use with various Circalok catalysts to create a two-component, RTV silicone system. The silicone system is designed to provide exce...
Circalok™ 6711 Silicone Encapsulant
LORD Circalok™ 6711 silicone encapsulant is formulated for use with various Circalok catalysts to create a two-component, thermally conductive encapsulant system with outstanding elect...
Circalok™ 6725
High density, thermally conductive, primerless silicone rubber....
Circalok™ 6726
Circalok™ 6726 A/B is an addition-cure silicone system and, therefore, produces no by-products. The system has excellent reversion resistance at high temperature and will not cause any...
Circalok™ 6754
Circalok™ 6754 is a white silicone grease used to provide a thermal path between semiconductors and heat sinks by displacing the air gap between the mating surfaces. Used as a non-curi...
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Electronic Materials in the News

LORD Corporation Develops New Flame-Retardant Urethane ...

Thermoset UR-288 flame retardant urethane encapsulantLORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the ...

LORD Corporation Announces First Recipient for Aerospac...

The first recipient of the Distributor of the Year Award for its Aerospace & Defense Business Unit has been announced.

Partnership Results in Optimal Design for Today and Tom...

To meet a request for a state-of-the-art thermal interface material that would dissipate heat from high-powered com...
Tradeshows & Events

Air Medical Transport Conference (AMTC)

Nashville, Tennessee   Sep 22 - Sep 24

Weapons and Tactics Analysis Center (WEPTAC) Show

Phoenix, AZ   Oct 13 - Oct 17

International Elastomer Conference

Nashville, Tennessee   Oct 14 - Oct 16

The International Elastomer Conference is an opportunity for traditional rubber and polymer companies and associated industries to gather with product and equipment manufactur...

HOC C-130 Hercules Operators Confence

Atlanta, Georgia   Oct 19 - Oct 19

FABTECH

Atlanta, Georgia   Nov 04 - Nov 06

Fabtech is North America's largest metal forming, fabricating, welding and finishing event....

18th Annual Regional & Business Aviation Industry Suppliers Conference

Paradise Valley, Arizona   Nov 06 - Dec 08

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