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Solar Energy

Photovoltaic
Thin Film
Concentrated / Solar Thermal
Ingot Bonding

We provide solutions for silicon ingot manufacturers in the photovoltaic market that reduce ingot waste, improve utilization of ingots, lower operating costs and increase slicing wire life ... Ask Us How.

INGOT BONDING

Are you an ingot manufacturer who would like to reduce waste during the wafer slicing process?

We offer LORD® 781 Epoxy Adhesive that can join dissimilar ingot lengths to facilitate easy ingot slicing with minimal waste.

Features & Benefits of LORD® 781 Epoxy Adhesive

  • Reduce ingot waste
  • Improve utilization of ingot
  • Lower operating costs
  • Increase slicing wire life

Typical Properties of LORD® 781 Epoxy Adhesive

  • Appearance: Yellow Paste
  • Viscosity: Thixotropic Paste
  • Hardness: (Shore D @80°C average): 70
  • Shear Strength (@80˚C): 67
  • Shelf Life: 1 Year
  • Cure Time: 1-3 Days
Learn More about LORD ® 781 Epoxy Adhesive
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