The bond line of a material is used to describe where a material contacts components, usually when it is sandwiched in between them. Typically, the most important quality of a bond line is its thickness. For liquid-dispensed materials, bond line is variable and is based on the stand-off that is present in each application.
To ensure a specific bond line thickness in materials, glass beads are often used. These are small spheres that are added at approximately 1% of the formulation weight to maintain the desired thickness for the application when the material is dispensed. When added at such a low percentage, glass beads can maintain the appropriate bond line thickness without negatively affecting the properties of the material.
Our extensive range of adhesives includes solutions with glass beads - enabling precise control of bond line thickness in applications ranging from industrial structural to automotive assembly-to-repair.
Our product line not only includes CoolTherm SC-322, which contains glass beads, but also a range of gels and greases that facilitate extremely thin bond lines - an attribute commonly required in electronics applications.