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查看 CoolTherm 产品 LORD CoolTherm® 热管理材料对半导体芯片的可靠性至关重要。热界面材料可有效地将热量从半导体芯片或封装传递到散热基板或散热器上,有胶粘剂、填缝材料、凝胶或硅脂等产品可供选择。这些材料可根据最终用途提供各种导热性能。
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White Paper - Lead-free Flip Chip Underfill