LORD Corporation Presenting Electronics Materials Technology Solutions at Strategies in Light Europe
( 09/09/2013 )
LORD Corporation will showcase adhesives and thermal management materials technology solutions at Strategies in Light Europe 2013.
The event will take place Nov. 19-21 at the M.O.C. Event Centre in Munich, Germany. LORD Corporation will be exhibiting in boothB12.
LORD Corporation will be showcasing adhesives and thermal management materials including gels, greases and encapsulants for LED applications. LORD thermally conductive materials are easily applied and have high thermal conductivity/low thermal resistance to improve device reliability. Specially designed for thermal conductivity for electrical/electronic encapsulating applications, LORD Thermoset SC-303, SC-309 and SC-320 are two-component systems designed to retain desirable properties associated with silicones. These silicone encapsulants exhibit low shrinkage and stress on components as they cure, and maintain a low viscosity for ease of component encapsulation compared to other highly thermal conductive materials. Environmentally resistant and UL-rated, Thermoset SC-303, SC-309 and SC-320 are composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.
More information on LORD Thermoset SC-303, SC-309 and SC-320 can be found at http://www.lord.com/electronicmaterials. Additional information can be obtained by contacting LORD Corporation by email at email@example.com or by phone at +1 877 ASK LORD (275 5673).
For more information or to register for Strategies in Light Europe 2013, visit www.sileurope.com/index.html.