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CoolTherm™ EP-6007/6010 Epoxy System Where to Buy

Product Information

LORD CoolTherm™ EP-6007/6010 epoxy system is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.

Shelf Life

Shelf life of each component is one year from date of manufacture when stored at 25°C in original, unopened container.

Features and Benefits

High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.

Electrically Insulative – provides excellent high voltage insulation.

Low Exotherm – exhibits low exotherm heat rise during room temperature cure.

Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -55°C to +130°C.

UL Rated – provides excellent flame retardancy; UL 94 V-0 certified; meets requirements of Military Specifications MIL T-27 and MIL I-16923.

Typical Properties*

Working Life, hr @ 25°C 2
Cure Time, hr @ 25°C 12 - 16

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 2 x 1016
Thermal Conductivity, W/mK 0.6
Coefficient of Linear Thermal Expansion, ppm/°C alpha 1 = 47
alpha 2 = 122
Glass Transition Temperature (Tg), °C 54
Hardness, Shore D 85
Tensile Strength, psi @ 25°C 8400
Elongation at Yield, % 0.7
Moisture Absorption, %, 10 days @ 25°C 0.4
Linear Shrinkage, in/in 0.002
Dielectric Strength, V/mil 490
Dielectric Constant, @ 25°C 4.3
Dissipation Factor, @ 25°C 0.02

*Data is typical and not to be used for specification purposes.


Download Type Name
Download Technical Data Sheet CoolTherm EP-6007 BLK Epoxy Resin