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CoolTherm™ SC-305 Thermally Conductive Silicone Encapsulant Where to Buy

Product Information

LORD CoolTherm™ SC-305 thermally conductive silicone encapsulant is a two-component system designed for encapsulation applications. It is suited for a variey of electronics applications where high heat dissipation is required. CoolTherm SC-305 encapsulant can be either room temperature cured or heat cured for maximum adhesion.

Shelf Life

Shelf life of each component is nine months from date of manufacture when stored at 25°C in original, unopened container.

CoolTherm SC-305 encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.

Features and Benefits

Low Stress – exhibits low shrinkage and stress on components as it cures.

High Thermal Conductivity – provides high thermal conductivity for applications where superior heat dissipation is required.

Durable – composed of an addition-curing polymer that will not depolymerize when heated in confined spaces.

Environmentally Resistant – provides excellent thermal shock resistance and flame retardancy.

Typical Properties*

Mixed Appearance Gray Liquid
Mixed Viscosity, cps @ 25°C 3500
Mixed Specific Gravity 1.50
Gel Time, min @ 60°C 10
Working Life, min @ 25°C 30
Cure Time 24 hr @ 25°C; or
30 min @ 60°C; or
10 min @ 100°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 3.3 x 1014
Thermal Conductivity, W/mK 0.7
Coefficient of Linear Thermal Expansion, ppm/°C 200
Glass Transition Temperature (Tg), °C > -100
Hardness, Shore A 60
Tensile Strength, psi 215
Elongation at Break, % 50
Moisture Absorption, % <0.5
Dielectric Strength, V/mil 500
Dielectric Constant, @ 25°C 3.2
Dissipation Factor, % @ 25°C 0.008

*Data is typical and not to be used for specification purposes.
Cure schedule of 24 hours at 25°C plus 2 hours at 60°C.


Download Type Name
Download Technical Data Sheet CoolTherm SC-305 Thermally Conductive Silicone Encapsulant
Download Selector Guide Electronic Materials for LED Applications
Download Filled Addition-Curing Silicone Encapsulant Handling/Application Notes