Showing 1 - 10 of 21
21
| Product | Viscosity | Mixed Viscosity | Cure Time | Thermal Conductivity | Glass Transition Temperature (Tg) | Technical Data Sheets |
|---|---|---|---|---|---|---|
| CoolTherm™ EP-6007/6010 Epoxy System |
12 - 16 |
0.6 |
54 |
 |
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| CoolTherm™ EP-6037/6252 Epoxy System |
24 hr @ 25°C; or |
1.1 |
70 |
|
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| CoolTherm™ SC-6703 Thermally Conductive Silicone Encapsulant |
8000 |
4 |
0.8 |
|
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| CoolTherm™ SC-6711/6730 Silicone Encapsulant |
12 - 16 |
1.0 |
||||
| CoolTherm™ EP-636 Epoxy Encapsulant |
50,000 |
16-24 hr @ 50-65°C, followed by 2 hr each @ 95°C, 150°C and 205°C |
180 |
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| Thermoset EP-20/65 Epoxy System | 24 |
|
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| Thermoset EP-20/70 Epoxy System | 24 |
|
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| Thermoset EP-809 Epoxy Encapsulant |
2800 |
12-16 hr @ 80-90°C; or |
95 |
|
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| Thermoset EP-937 Board Level Encapsulant |
47,900 |
125 |
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| Thermoset ES-111 Epoxy Encapsulant | 8000 | 145 |
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