Product | Viscosity | Mixed Viscosity | Cure Time | Thermal Conductivity | Glass Transition Temperature (Tg) | Technical Data Sheets |
---|---|---|---|---|---|---|
CoolTherm™ EP-6007/6010 Epoxy System |
12 - 16 |
0.6 |
54 |
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CoolTherm™ EP-6037/6252 Epoxy System |
24 hr @ 25°C; or |
1.1 |
70 |
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CoolTherm™ SC-6703 Thermally Conductive Silicone Encapsulant |
8000 |
4 |
0.8 |
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CoolTherm™ SC-6711/6730 Silicone Encapsulant |
12 - 16 |
1.0 |
||||
CoolTherm™ EP-636 Epoxy Encapsulant |
50,000 |
16-24 hr @ 50-65°C, followed by 2 hr each @ 95°C, 150°C and 205°C |
180 |
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CoolTherm™ SC-305 Thermally Conductive Silicone Encapsulant |
3500 |
24 hr @ 25°C; or |
0.7 |
> -100 |
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|
CoolTherm™ SC-320 Thermally Conductive Silicone Encapsulant |
22,000 |
24 hr @ 25°C; or |
3.2 |
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Thermoset™ SC-324 Thermally Conductive Silicone Encapsulant |
24 hr @ 25°C; or |
4.0 |
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|||
Thermoset™ SC-252 Thermally Conductive Silicone Encapsulant |
10,000 |
24 hours @ 25°C; or |
2.5 |
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CoolTherm™ SC-309 Thermally Conductive Silicone Encapsulant |
3600 |
24 hr @ 25°C; or |
1.0 |
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