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Potting and Encapsulation Products

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Product	Viscosity	Mixed Viscosity	Cure Time	Thermal Conductivity	Glass Transition Temperature (Tg)	Technical Data Sheets
CoolTherm™ EP-6007/6010 Epoxy System			12 - 16	0.6	54
CoolTherm™ EP-6037/6252 Epoxy System			24 hr @ 25°C; or 2 hr @ 65°C	1.1	70
CoolTherm™ SC-6703 Thermally Conductive Silicone Encapsulant		8000	4	0.8
CoolTherm™ SC-6711/6730 Silicone Encapsulant			12 - 16	1.0
CoolTherm™ EP-636 Epoxy Encapsulant		50,000	16-24 hr @ 50-65°C, followed by 2 hr each @ 95°C, 150°C and 205°C		180
CoolTherm™ SC-305 Thermally Conductive Silicone Encapsulant		3500	24 hr @ 25°C; or 30 min @ 60°C; or 10 min @ 100°C	0.7	> -100
CoolTherm™ SC-320 Thermally Conductive Silicone Encapsulant		22,000	24 hr @ 25°C; or 60 min @ 125°C	3.2
Thermoset™ SC-324 Thermally Conductive Silicone Encapsulant			24 hr @ 25°C; or 60 min @ 125°C	4.0
Thermoset™ SC-252 Thermally Conductive Silicone Encapsulant		10,000	24 hours @ 25°C; or 45 min @ 85°C; or 30 min @ 120°C	2.5
CoolTherm™ SC-309 Thermally Conductive Silicone Encapsulant		3600	24 hr @ 25°C; or 15 min @ 100°C; or 10 min @ 120°C	1.0