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LORD Corporation

With more than 3,000 employees in 26 countries and 16 manufacturing facilities and eight R&D centers worldwide, we're there for our customers ... Ask Us How.

Our Company

Semiconductor Packaging & Circuit Assembly Materials

Surface Mount Adhesives | Die Attach Adhesives | Glob Top Encapsulants | Dam Encapsulants | Underfill Encapsulants

Our semiconductor packaging materials range from surface mount and die attach adhesives to glob top, dam and underfill encapsulants.

Semiconductor packaging materials are materials used to assemble semiconductor packages and range from adhesives to encapsulants. Our surface mount and die attach adhesives are designed to enhance the assembly process and improve reliability. Our glob top, dam and underfill encapsulants provide environmental protecction, reduce warpage, demonstrate excellent flow, offer good adhesion to multiple substrates and have the strength to handle over-molding and subsequent process steps.

 

 

 

Thermal Management Materials for Microelectronics

LORD CoolTherm® thermal management materials are critical to the reliability of the semiconductor chip. Thermal interface materials are used to effectively transfer heat from the semiconductor chip or package to the heat sink or heat spreader and are available in adhesives, gap fillers, gels or greases. These materials offer a variety of thermal performances, dependent on the end use application.

DOCUMENTS

News

LORD Corporation Announces New AS350 Tail Rotor Bearing

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LORD Corporation Expands Capabilities of Wireless Sensors with New Products for 2019

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LORD Corporation Thermal Management Technology Improves Performance for EVs and Trains

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Introducing our New Chemlok® Family

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LORD Corporation Offers Popular Elastomeric Component Training at Heli-Expo

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Events

Advanced E-Motor Technology Conference 2019

Berlin, Germany

Global Automotive Lightweight Materials Europe 2019

Munich, Germany

Electric and Hybrid Vehicle Tech Expo 2019

Stuttgart, Germany

CWIEME 2019

Berlin, Germany

International Rubber Conference 2019

London, the UK

Coiltech 2019

Pordenone, Italy

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