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Thermoset™ SC-252 Thermally Conductive Silicone Encapsulant Contact Us to Buy

Product Information

LORD Thermoset™ SC-252 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. Thermoset SC-252 encapsulant can be either room temperature cured or heat cured for maximum adhesion.

Shelf Life

Shelf life of each component is six months from date of manufacture when stored at 25°C in original, unopened container.

Thermoset SC-252 hardener evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.

Features and Benefits

Low Stress – exhibits low shrinkage and stress on components as it cures.

Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.

High Thermal Conductivity – provides high thermal conductivity for applications where superior heat dissipation is required.

Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Environmentally Resistant – provides excellent thermal shock resistance.

Typical Properties*

Mixed Appearance Gray Liquid
Mixed Viscosity, cps @ 25°C
10s-1 Shear Rate
Mixed Specific Gravity 2.93
Gel Time, min @ 121°C 5-10
Working Life, min @ 25°C 45
Cure Time 24 hours @ 25°C; or
45 min @ 85°C; or
30 min @ 120°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C > 1 x 1014
Thermal Conductivity, W/mK 2.5
Hardness, Shore A 60
Dielectric Constant, @ 25°C 5
Dissipation Factor, % @ 25°C 0.007

* Data is typical and not to be used for specification purposes.
Cure schedule of 45 minutes at 85°C.


Download Type Name
Download Technical Data Sheet Thermoset SC-252 Thermally Conductive Silicone Encapsulant
Download Filled Addition-Curing Silicone Encapsulant Handling/Application Notes