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Thermoset SC-300M Silicone Encapsulant Where to Buy

Product Information

LORD Thermoset SC-300M silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. Thermoset SC-300M encapsulant system cures to an extremely soft, gel-like consistency using either room temperature or heat cure.

Shelf Life

Shelf life of each component is six months from date of manufacture when stored at 25°C in original, unopened container.

Thermoset SC-300M hardener evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.

Features and Benefits

Low Stress – exhibits low shrinkage and stress on components as it cures.

Excellent Adhesion – provides excellent adhesion to most substrates without the use of a primer.

Durable – composed of an addition-curing polymer that will not depolymerize when heated in confined spaces.

Insulative – provides excellent electrical insulation properties; provides thermal, mechanical and vibration damping.

Typical Properties*

Mixed Appearance Clear Liquid
Mixed Viscosity, cps @ 25°C 160
Mixed Specific Gravity 0.99
Gel Time, min @ 25°C 50
Working Life, min @ 25°C 30
Cure Time 24 hr @ 25°C; or
16 hr @ 25°C followed by 2 hr @ 100°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 9.9 x 1014
Thermal Conductivity, W/mK 0.2
Coefficient of Linear Thermal Expansion, ppm/°C @ 25°C 326
Glass Transition Temperature (Tg), °C -110
Hardness Soft Gel
Storage Modulus, MPa 2.75 x 10-3
Dielectric Constant, @ 25°C 2.7
Dissipation Factor, @ 25°C 0.005

*Data is typical and not to be used for specification purposes.
Cure schedule of 16 hours at 25°C plus 2 hours at 100°C.

Literature

Download Type Name
Download MSDS (US) Thermoset SC-300M Resin
Download MSDS (US) Thermoset SC-300M Hardener
Download Technical Data Sheet Thermoset SC-300M Silicone Encapsulant
Download Unfilled Addition-Curing Silicone Encapsulant Handling/Application Notes