Thermoset SC-300M Silicone Encapsulant Where to Buy
LORD Thermoset SC-300M silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. Thermoset SC-300M encapsulant system cures to an extremely soft, gel-like consistency using either room temperature or heat cure.
Shelf life of each component is six months from date of manufacture when stored at 25°C in original, unopened container.
Thermoset SC-300M hardener evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Excellent Adhesion – provides excellent adhesion to most substrates without the use of a primer.
Durable – composed of an addition-curing polymer that will not depolymerize when heated in confined spaces.
Insulative – provides excellent electrical insulation properties; provides thermal, mechanical and vibration damping.
|Mixed Appearance||Clear Liquid|
|Mixed Viscosity, cps @ 25°C||160|
|Mixed Specific Gravity||0.99|
|Gel Time, min @ 25°C||50|
|Working Life, min @ 25°C||30|
24 hr @ 25°C; or
16 hr @ 25°C followed by 2 hr @ 100°C
Cured Typical Properties*
|Volume Resistivity, ohm-cm @ 25°C||9.9 x 1014|
|Thermal Conductivity, W/mK||0.2|
|Coefficient of Linear Thermal Expansion, ppm/°C @ 25°C||326|
|Glass Transition Temperature (Tg), °C||-110|
|Storage Modulus, MPa||2.75 x 10-3|
|Dielectric Constant, @ 25°C||2.7|
|Dissipation Factor, @ 25°C||0.005|
*Data is typical and not to be used for specification purposes.
Cure schedule of 16 hours at 25°C plus 2 hours at 100°C.