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Thermoset™ SC-324 Thermally Conductive Silicone Encapsulant Where to Buy

Product Information

LORD Thermoset™ SC-324 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.

Shelf Life

Shelf life of each component is six months from date of manufacture when stored at 25°C in original, unopened container.

Thermoset SC-324 encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.

Features and Benefits

Low Stress – exhibits low shrinkage and stress on components as it cures.

Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.

Environmentally Resistant – provides excellent thermal shock resistance.

Typical Properties*

Mixed Appearance Light Pink Liquid
Mixed Specific Gravity 3.2
Working Life, min @ 25°C 30
Cure Time 24 hr @ 25°C; or
60 min @ 125°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C >2 x 1013
Thermal Conductivity, W/mK 4.0
Hardness, Shore A 50
Tensile Strength, psi 119
Elongation at Break, % 10
Moisture Absorption, % < 0.1
Dielectric Constant, @ 25°C 4.5
Dissipation Factor, % @ 25°C <1
Extractable Ionic Contaminants Chloride = <10
Sodium = <10
Potassium = <10
Ammonium = <10
Bromide = <10
Sulfate = <10

*Data is typical and not to be used for specification purposes.
Cure schedule of 60 minutes at 125°C.


Download Type Name
Download Technical Data Sheet Thermoset SC-324 Thermally Conductive Silicone Encapsulant
Download Addition-Cure Silicone Encapsulant Inhibition Guide