LORD Corporation Develops New Flame-Retardant Urethane Encapsulant
( 11/27/2012 )
LORD Corporation has announced the availability of a new flame retardant urethane encapsulant for the electronic materials industry.
Specially designed for encapsulating and casting applications, LORD Thermoset UR-288 encapsulant cures at room temperature to produce a flame-retardant, semi-flexible material. This new urethane encapsulant exhibits low shrinkage and stress on components as it cures, and maintains a low viscosity for complete and void-free encapsulation. Suitable for curing at room temperature, Thermoset UR-288 produces low exothermic heat rise during cure. Further, it provides excellent thermal shock resistance.According to Jim Grieg, Sales and Marketing Manager, Electronic Materials, Thermoset UR-288 was designed in response to increasing market demand for flame-retardant urethane materials.More information on LORD Thermoset UR-288 can be found at http://www.lord.com/electronicmaterials. Additional information can be obtained by contacting LORD Corporation by email at email@example.com or by phone at +1 877 ASK LORD (275 5673).