Technology Presented at Suss Technology Forum at Semicon West 2013
( 06/26/2013 )
The SUSS Technology Forum covers the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging. The event will took place July 9-11 at The Regis at San Francisco; San Francisco, Calif. The presentation was titled "Increased WLCSP Device Reliability Using Improved Final Passivation Material."
The presentation described the processing and improved reliability performance of a photo-definable wafer level coating with a low coefficient of thermal expansion (CTE). Le demonstrated how the wafer level coating can be applied as a final passivation layer and is compatible with conventional processing methods. In addition to the advantages which are inherent to WLCSPs, the presentation reviewed how these materials demonstrate significant improvements in thermal cycling reliability and drop test analysis.
As a Senior Scientist at LORD, he focuses on developing formulations for microelectronic applications. He has extensive experience in the synthesis of fine metallic particles, coatings, and polymers. Le holds a Bachelor of Science degree in chemistry and a Master's of Science in colloid and surface chemistry from Clarkson University. Recently, Le earned his Ph.D. in polymer chemistry from the University of North Carolina at Chapel Hill.
For more information about SUSS Technology Forum, visit http://www.suss.com/en/company/organization/events/2013/semicon-west-2013.html.