We specialize in developing world-class thermal management, potting and encapsulation, gap filling, semiconductor packing, adhesive and thick film materials for demanding applications. Our experience in electronic materials spans more than 50 years, and we incorporate this vast knowledge in developing solutions for new applications to help ensure our customers' success.
The custom solutions we develop for our customers address specific performance requirements. We continue with this approach today, and the result - a more customized, optimum solution to address customer needs with a rapid response time. Our product portfolio and technical expertise includes multiple chemistries, namely urethanes, epoxies and silicones. This product and expertise diversity allows us to select the chemistry that is the best fit for our customers' performance and cost requirements. To learn more, explore our products below or visit our frequently asked questions page.
CoolTherm® is the latest advancement in thermal management and infuses our high-performance thermal interface materials with world-class service and support.
Our thermal management solutions are recognized for reliability and customized for use in electric vehicles, energy storage systems, motors, and other power electronics.
Utilizing epoxy, silicone and urethane polymer systems, we deliver results for demanding applications based on our customers' design and specification needs.
Our products offer diverse encapsulant application options including use in ignition coils, engine control modules, sensors, power supplies, transformers and other critical electronic equipment.
CoolTherm thermally conductive gap fillers are two-component systems designed to provide excellent thermal conductivity for battery pack and electronics applications.
Our gap fillers exhibits low shrinkage and stress on components as they cure. They also will not depolymerize when heated in confined spaces and provides excellent thermal shock resistance.
Semiconductor packaging materials range from adhesives to encapsulants. Our surface mount and die attach adhesives are designed to enhance the assembly process and improve reliability.
Our glob top, dam and underfill encapsulants provide environmental protecction, reduce warpage, demonstrate excellent flow, and offer good adhesion and strength.
Whether you need better structural integrity or an improved thermal connection, our solutions are custom-tailored for your application.
Our adhesives provide mechanical rigidity, a thermal connection and the ability to bond a wide variety of substrates. They also reduce the need for fasteners, thereby simplifying your design.
LORD's thick film materials include a variety of products to fit all of our customers' requirements.
Our offerings include a wide selection of different silver conductors, polymer resistors, protective coatings, marking inks, solvents, carbon resistors and conductive coatings.