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LORD Corporation

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CoolTherm® EP-6037/6252 Epoxy System Where to Buy


Product Information

LORD CoolTherm® EP-6037/6252 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. CoolTherm EP-6037/6252 epoxy system can also be used for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components.

Shelf Life

Shelf life for each component is one year from date of manufacture when stored at 25°C in original, unopened container.

Features and Benefits

Low Stress – exhibits low shrinkage and stress on components as it cures.

Excellent Adhesion – provides a strong adhesion bond to a wide variety of substrates.

Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during severe temperature cycling.

Uncured Typical Properties*

Working Life, hr @ 25C 3
Cure Time 24 hr @ 25°C; or
2 hr @ 65°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C >1x1015
Thermal Conductivity, W/mK 1.1
Coefficient of Linear Thermal Expansion, ppm/°C 31
Glass Transition Temperature (Tg), °C 70
Hardness, Shore D 92
Tensile Strength, psi @ 25°C 8700
Lap Shear Strength, psi @ 25°C
Aluminum to aluminum, 1” overlap
2175
Elongation at Break, % 4.1
Moisture Absorption, %
10 days @ 25°C
0.17
Dielectric Strength, V/mil >400

*Data is typical and not to be used for specification purposes.

Literature

Download Type Name
Download Safety Data Sheet CoolTherm EP-6037 Black
Download Safety Data Sheet CoolTherm EP-6037 Green
Download Technical Data Sheet CoolTherm EP-6037 Epoxy Resin
Download Safety Data Sheet CoolTherm EP-6252
Download Technical Data Sheet CoolTherm EP-6252 Hardener
Download Product Catalog Microelectronic Materials Catalog
Download Product Catalog Potting & Encapsulation Materials

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