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LORD Corporation

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CoolTherm® SC-6702 Thermally Conductive Silicone Encapsulant Where to Buy


Product Information

LORD CoolTherm® SC-6702 thermally conductive silicone encapsulant is a two-component system designed to provide thermal conductivity for encapsulating sensitive electronic modules.

Shelf Life

Shelf life of each component is six months from date of manufacture when stored at temperatures up to 40°C in original, unopened container.

Features and Benefits

Convenient – easy to use 1:1 mix ratio, by weight or volume.

Primerless Adhesion – adheres without the use of a primer in most applications.

High Thermal Conductivity – provides thermal conductivity for applications where superior heat dissipation is required.

Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -55°C to 260°C.

UL Rated – provides excellent flame retardancy; UL 94 V-O certified.

Uncured Typical Properties*

Mixed Appearance Red Liquid
Mixed Viscosity, cps @ 25°C 30,000
Mixed Specific Gravity 2.09
Gel Time, min @ 66°C 25
Working Life, hr @ 25°C 4
Cure Time, hr @ 85°C 16-24

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 1.7 x 1015
Thermal Conductivity, W/mK 0.7
Coefficient of Linear Thermal Expansion, ppm/°C 239
Hardness, Shore A 65
Tensile Strength, psi 600
Elongation at Break, % 80
Dielectric Strength, V/mil 434
Dielectric Constant, @ 25°C
1 MHz
5.5
Dissipation Factor, @ 25°C
1 MHz
0.014

*Data is typical and not to be used for specification purposes.

Literature

Download Type Name
Download Safety Data Sheet CoolTherm SC-6702 Resin
Download Safety Data Sheet CoolTherm SC-6702
Download Safety Data Sheet CoolTherm SC-6702 Black Resin
Download Technical Data Sheet CoolTherm SC-6702 Thermally Conductive Silicone Encapsulant
Download Product Catalog Potting & Encapsulation Materials
Download Filled Addition-Curing Silicone Encapsulant Handling/Application Notes

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