CoolTherm® EP-6007 BLK/Thermoset No. 67 Epoxy System Where to Buy
LORD CoolTherm® EP-6007 BLK/Thermoset No. 67 epoxy system is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.
Shelf life of CoolTherm EP-6007 BLK resin is one year from date of shipment when stored at 25°C in original, unopened container.
Shelf life of Thermoset Hardener No. 67 is 18 months from date of manufacture when stored in a well ventilated area at 25°C in original,unopened container.
Features and Benefits
High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.
Electrically Insulative – provides excellent high voltage insulation.
Low Exotherm – exhibits low exotherm heat rise during room temperature cure.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -55°C to +130°C.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified; meets requirements of Military Specifications MIL T-27 and MIL I-16923.
Uncured Typical Properties*
|Working Life, hr @ 25°C||8|
16 hr @ 65°C; or
5 hr @ 100°C; or
3 hr @ 130°C
Cured Typical Properties*
|Volume Resistivity, ohm-cm @ 25°C||2 x 1016|
|Thermal Conductivity, W/mK||0.5|
|Coefficient of Linear Thermal Expansion, ppm/°C||
alpha 1 = 42
alpha 2 = 140
|Glass Transition Temperature (Tg), °C||94|
|Hardness, Shore D||85|
|Tensile Strength, psi @ 25°C||9800|
|Elongation at Yield, %||1.2|
|Moisture Absorption, %, 10 days @ 25°C||0.4|
|Linear Shrinkage, in/in||0.003|
|Dielectric Strength, V/mil||500|
|Dielectric Constant, @ 25°C||4.4|
|Dissipation Factor, @ 25°C||0.02|
*Data is typical and not to be used for specification purposes.
**Cure schedule suitable for pourings of up to 227 grams in a concentrated mass.