CoolTherm® EP-6008 BLK/Thermoset No.67 Epoxy System Where to Buy
LORD CoolTherm® EP-6008 BLK/Thermoset™ No.67 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
Shelf life of CoolTherm EP-6008 BLK resin is one year from date of manufacture when stored at 25°C in original, unopened container.
Shelf life of Thermoset Hardener No. 67 is 18 months from date of manufacture when stored in a well ventilated area at 25°C in original, unopened container.
Features and Benefits
Good Insulation – protects components from moisture and vibrations.
Low Viscosity – self-leveling liquid maintains low viscosity for ease of component encapsulation.
Low Stress – exhibits low shrinkage and stress on components as it cures.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -55°C to +155°C.
Uncured Typical Properties*
|Working Life, hr @ 25°C||4 - 6|
|Cure Time, hr @ 100°C||3|
Cured Typical Properties*
|Volume Resistivity, ohm-cm @ 25°C||>1014|
|Thermal Conductivity, W/mK||0.3|
|Coefficient of Linear Thermal Expansion, ppm/°C||40|
|Hardness, Shore D||85|
|Tensile Strength, psi @ 25°C||7200|
|Elongation at Break, %||1.8|
|Moisture Absorption, %, 10 days @ 25°C||0.35|
|Linear Shrinkage, in/in||0.004|
|Dielectric Strength, V/mil||450|
|Dielectric Constant, @ 25°C||4.0|
|Dissipation Factor, @ 25°C||0.02|
*Data is typical and not to be used for specification purposes.