CoolTherm® EP-6035 Epoxy Encapsulant Where to Buy
LORD CoolTherm® EP-6035 epoxy encapsulant is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.
Shelf life of each component is one year from date of manufacture when stored at 25°C in original, unopened container.
Features and Benefits
Low Viscosity – maintains low viscosity for complete and void-free encapsulation.
High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.
Electrically Insulative – provides excellent high voltage insulation.
Low Exotherm – exhibits low exotherm heat rise during room temperature cure.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from-65°C to +155°C.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.
|Mixed Appearance||Black Liquid|
|Mixed Viscosity, cps @ 25°C||12,000|
|Mixed Specific Gravity||1.57|
|Working Life, hr @ 25°C||2|
24 hr @ 25°C; or
2 hr @ 65°C
Cured Typical Properties*
|Volume Resistivity, ohm-cm @ 25°C||1 x 1016|
|Thermal Conductivity, W/mK||1.0|
|Coefficient of Linear Thermal Expansion, ppm/°C||35|
|Hardness, Shore D||75|
|Tensile Strength, psi||5000|
|Elongation at Break, %||5.0|
|Dielectric Strength, V/mil||475|
*Data is typical and not to be used for specification purposes.