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LORD Corporation

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CoolTherm® EP-6035 Epoxy Encapsulant Where to Buy


Product Information

LORD CoolTherm® EP-6035 epoxy encapsulant is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.

Shelf Life

Shelf life of each component is one year from date of manufacture when stored at 25°C in original, unopened container.

Features and Benefits

Low Viscosity – maintains  low viscosity for complete and void-free encapsulation.

High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.

Electrically Insulative – provides excellent high voltage insulation.

Low Exotherm – exhibits low exotherm heat rise during room temperature cure.

Broad Temperature Range – can be used on parts and devices that experience operating temperatures from-65°C to +155°C.

UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.

Typical Properties*

Mixed Appearance Black Liquid
Mixed Viscosity, cps @ 25°C 12,000
Mixed Specific Gravity 1.57
Working Life, hr @ 25°C 2
Cure Time 24 hr @ 25°C; or
2 hr @ 65°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 1 x 1016
Thermal Conductivity, W/mK 1.0
Coefficient of Linear Thermal Expansion, ppm/°C 35
Hardness, Shore D 75
Tensile Strength, psi 5000
Elongation at Break, % 5.0
Dielectric Strength, V/mil 475
Dielectric Constant 4.1
Dissipation Factor 0.025

*Data is typical and not to be used for specification purposes.

Literature

Download Type Name
Download Safety Data Sheet COOLTHERM EP-6035 BLACK RESIN
Download Safety Data Sheet CoolTherm EP-6035 Hardener
Download Product Catalog Potting & Encapsulation Materials
Download Technical Data Sheet CoolTherm EP-6035 Epoxy Encapsulant

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