CoolTherm® MG-121 Thermally Conducive Gel Where to Buy
LORD CoolTherm® MG-121 thermally conductive gel is a one-component, silicone interface material that exhibits very low thermal resistance properties compared to other thermal interface materials currently available. It is formulated to provide good HAST resistance.
CoolTherm MG-121 gel is designed to provide efficient heat transfer from flip chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The gel is formulated to inhibit bleed, separation and pump-out that are typically observed in many thermal interface materials.
Shelf life is six months from date of manufacture when stored at -30°C in original, unopened container. Syringe must be maintained at -30°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally). Material crystallizes at -40°C; avoid storing material at -40°C or below.
This material is shipped and stored frozen. Consult handling instructions** for thawing.
**Handling instructions are available on LORD.com.
Features and Benefits
Thin Bondlines - achieves thin bondlines of 1-2 mils, minimizing the thermal pathway and maximizing heat flow.
HAST Resistance - enhances reliability of non-hermetic packaged devices in high humidity environments.
High Thermal Conductivity - provides high thermal conductivity for applications where superior heat dissipation is required.
Low Thermal Resistance - provides minimal thermal resistance due to low viscosity and good wetting.
High Reliability - provides excellent resistance to moisture and temperature cycling; resists pump-out and cracking.
Reworkability - low modulus at elevated temperatures allows material to be repaired.
Uncured Typical Properties*
Viscosity, cps @ 25°C
Viscosity, cps @ 25°C
|Gel Time, min @ 100°C||8|
|Working Life, hr @ 25°C||8|
2 hr @ 100°C; or
60 min @ 125°C; or
30 min @ 150°C
Cured Typical Properties*
|Volume Resistivity, ohm-cm @ 25°C||8 x 1013|
|Thermal Conductivity, W/mK||2.3|
Coefficient of Linear Thermal Expansion, ppm/°C
|Glass Transition Temperature (Tg), °C||-121|
|Storage Modulus, Pa @ 25°C||30,000|
*Data is typical and not to be used for specification purposes.