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CoolTherm® MG-121 Thermally Conducive Gel Where to Buy

Product Information

LORD CoolTherm® MG-121 thermally conductive gel is a one-component, silicone interface material that exhibits very low thermal resistance properties compared to other thermal interface materials currently available. It is formulated to provide good HAST resistance.

CoolTherm MG-121 gel is designed to provide efficient heat transfer from flip chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The gel is formulated to inhibit bleed, separation and pump-out that are typically observed in many thermal interface materials.

Shelf Life

Shelf life is six months from date of manufacture when stored at -30°C in original, unopened container. Syringe must be maintained at -30°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally). Material crystallizes at -40°C; avoid storing material at -40°C or below.

This material is shipped and stored frozen. Consult handling instructions** for thawing.

**Handling instructions are available on LORD.com.

Features and Benefits

Thin Bondlines - achieves thin bondlines of 1-2 mils, minimizing the thermal pathway and maximizing heat flow.

HAST Resistance - enhances reliability of non-hermetic packaged devices in high humidity environments.

High Thermal Conductivity - provides high thermal conductivity for applications where superior heat dissipation is required.

Low Thermal Resistance - provides minimal thermal resistance due to low viscosity and good wetting.

High Reliability - provides excellent resistance to moisture and temperature cycling; resists pump-out and cracking.

Reworkability - low modulus at elevated temperatures allows material to be repaired.

Uncured Typical Properties*

Appearance Gray Paste
Viscosity, cps @ 25°C
20 rpm
Viscosity, cps @ 25°C
10 rpm
Specific Gravity 2.56
Gel Time, min @ 100°C 8
Working Life, hr @ 25°C 8
Cure Time 2 hr @ 100°C; or
60 min @ 125°C; or
30 min @ 150°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 8 x 1013
Thermal Conductivity, W/mK 2.3
Coefficient of Linear Thermal Expansion, ppm/°C
alpha 2
Glass Transition Temperature (Tg), °C -121
Storage Modulus, Pa @ 25°C 30,000

*Data is typical and not to be used for specification purposes.


Download Type Name
Download Safety Data Sheet CoolTherm MG-121
Download Product Catalog Microelectronic Materials Catalog
Download Technical Data Sheet CoolTherm MG-121 Thermally Conducive Gel
Download User Instructions Electronic Materials Handling Instructions (-30°C Storage Temperature)
Download Selector Guide Electronic Materials for LED Applications
Download Filled Addition-Curing Silicone Encapsulant Handling/Application Notes

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