m

LORD Corporation

With more than 3,100 employees in 26 countries, 19 manufacturing facilities and 10 R&D centers worldwide, we're there for our customers.

Our Company

CoolTherm® MG-122 Thermally Conductive Gel Where to Buy


Product Information

LORD CoolTherm® MG-122 thermally conductive gel is a one-component, silicone interface material that exhibits the low thermal resistance properties of a grease while possessing the integrity of a gel. It is specifically developed for excellent HAST resistance.

CoolTherm MG-122 gel is designed to provide efficient heat transfer from flip chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The gel is formulated to inhibit bleed, separation and pump-out that are typically observed in many thermal interface materials.

Shelf Life

Shelf life is six months from date of manufacture when stored at -30°C in original, unopened container. Syringe must be maintained at -30°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally). Material crystallizes at -40°C; avoid storing material at -40°C or below.

This material is shipped and stored frozen. Consult handling instructions** for thawing.

**Handling instructions available on LORD.com.

Features and Benefits

Excellent HAST Resistance - enhances reliability of non-hermetic packaged devices in high humidity environments.

High Thermal Conductivity - provides high thermal conductivity for applications where superior heat dissipation is required.

Low Thermal Resistance - provides minimal thermal resistance due to low viscosity and good wetting.

High Reliability - provides excellent resistance to moisture and temperature cycling; resists pump-out and cracking.

Reworkability - low modulus at elevated temperatures allows material to be repaired.

Uncured Typical Properties*

Appearance Gray Paste
Viscosity, cps @ 25°C
20 rpm
60,000
Viscosity, cps @ 25°C
10 rpm
85,000
Specific Gravity 2.57
Gel Time, min @ 100°C 8
Working Life, hr @ 25°C 16
Cure Time 60 min @ 120°C; or
30 min @ 150°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 8 x 1013
Thermal Conductivity, W/mK 2.8
Coefficient of Linear Thermal Expansion, ppm/°C
alpha 2
232
Glass Transition Temperature (Tg), °C -121
Storage Modulus, Pa @ 25°C 32,000

*Data is typical and not to be used for specification purposes.

Literature

Download Type Name
Download Safety Data Sheet CoolTherm MG-122
Download Product Catalog Microelectronic Materials Catalog
Download Technical Data Sheet CoolTherm MG-122 Thermally Conductive Gel
Download User Instructions Electronic Materials Handling Instructions (-30°C Storage Temperature)
Download Filled Addition-Curing Silicone Encapsulant Handling/Application Notes

Contact Us