CoolTherm® SC-305 Thermally Conductive Silicone Encapsulant Where to Buy
LORD CoolTherm® SC-305 thermally conductive silicone encapsulant is a two-component system designed for encapsulation applications. It is suited for a variey of electronics applications where high heat dissipation is required. CoolTherm SC-305 encapsulant can be either room temperature cured or heat cured for maximum adhesion.
Shelf life of each component is nine months from date of manufacture when stored at 25°C in original, unopened container.
CoolTherm SC-305 encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
High Thermal Conductivity – provides high thermal conductivity for applications where superior heat dissipation is required.
Durable – composed of an addition-curing polymer that will not depolymerize when heated in confined spaces.
Environmentally Resistant – provides excellent thermal shock resistance and flame retardancy.
|Mixed Appearance||Gray Liquid|
|Mixed Viscosity, cps @ 25°C||3500|
|Mixed Specific Gravity||1.50|
|Gel Time, min @ 60°C||10|
|Working Life, min @ 25°C||30|
24 hr @ 25°C; or
30 min @ 60°C; or
10 min @ 100°C
Cured Typical Properties*
|Volume Resistivity, ohm-cm @ 25°C||3.3 x 1014|
|Thermal Conductivity, W/mK||0.7|
|Coefficient of Linear Thermal Expansion, ppm/°C||200|
|Glass Transition Temperature (Tg), °C||> -100|
|Hardness, Shore A||60|
|Tensile Strength, psi||215|
|Elongation at Break, %||50|
|Moisture Absorption, %||<0.5|
|Dielectric Strength, V/mil||500|
|Dielectric Constant, @ 25°C||3.2|
|Dissipation Factor, % @ 25°C||0.008|
*Data is typical and not to be used for specification purposes.
Cure schedule of 24 hours at 25°C plus 2 hours at 60°C.