m

LORD Corporation

With more than 3,100 employees in 26 countries, 19 manufacturing facilities and 10 R&D centers worldwide, we're there for our customers.

Our Company
Learn about Parker’s safety-focused approach to COVID-19. Read More

CoolTherm® SC-324 Thermally Conductive Silicone Encapsulant Where to Buy


Product Information

LORD CoolTherm® SC-324 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.

Shelf Life

Shelf life of each component is six months when stored at 25°C in original, unopened container.

CoolTherm SC-324 encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.

Features and Benefits

Low Stress – exhibits low shrinkage and stress on components as it cures.

Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials.

Environmentally Resistant – provides excellent thermal shock resistance.

Typical Properties*

Mixed Appearance Light Pink Liquid
Mixed Viscosity, cP @ 25°C 30,000
Mixed Specific Gravity 3.2
Working Life, min @ 25°C 30
Cure Time 24 hr @ 25°C; or
60 min @ 125°C

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C >2 x 1013
Thermal Conductivity, W/m·K 4.0
Coefficient of Linear Thermal Expansion, ppm/°C 105
Hardness, Shore A 50
Tensile Strength, MPa (psi) 0.82 (119)
Elongation at Break, % 10
Moisture Absorption, % < 0.1
Dielectric Strength, kV/mm (V/mil) 7.4 (188)
Dielectric Constant, @ 25°C 4.5
Dissipation Factor, % @ 25°C <1
Extractable Ionic Contaminants Chloride = <10
Sodium = <10
Potassium = <10
Ammonium = <10
Bromide = <10
Sulfate = <10

*Data is typical and not to be used for specification purposes.
Cure schedule of 60 minutes at 125°C.

Literature

Download Type Name
Download Safety Data Sheet CoolTherm SC-324 Resin
Download Technical Data Sheet CoolTherm SC-324 Thermally Conductive Silicone Encapsulant
Download White Paper Thermally Conductive Potting Compounds Enable Higher Power Density Electronics
Download Addition-Cure Silicone Encapsulant Inhibition Guide
Download CoolTherm SC-324 Silicone Encapsulant Handling/Application Notes

Contact Us