CoolTherm® EP-6037/6010 Epoxy System Where to Buy
LORD CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. CoolTherm EP-6037/6010 epoxy system can also be used for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components.
Shelf life for each component is one year from date of manufacture when stored at 25°C in original, unopened container.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Excellent Adhesion – provides a strong adhesion bond to a wide variety of substrates.
Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during severe temperature cycling.
Uncured Typical Properties*
|Working Life, hr @ 25C||2|
24 hr @ 25°C; or
2 hr @ 65°C
Cured Typical Properties*
|Volume Resistivity, ohm-cm @ 25°C||>1015|
|Thermal Conductivity, W/mK||1.2|
|Coefficient of Linear Thermal Expansion, ppm/°C||52|
|Glass Transition Temperature (Tg), °C||106|
|Hardness, Shore D||93|
|Tensile Strength, MPa @ 25°C||50|
Lap Shear Strength, MPa @ 25°C
Aluminum to aluminum, 1” overlap
|Elongation at Break, %||1.9|
Moisture Absorption, %
10 days @ 25°C
|Dielectric Strength, V/mil||>400|
*Data is typical and not to be used for specification purposes.