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LORD Corporation

With more than 3,100 employees in 26 countries, 19 manufacturing facilities and 10 R&D centers worldwide, we're there for our customers.

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Potting & Encapsulation Materials

Encapsulants & Potting Compounds for Electronics Applications

At LORD, we have been developing custom potting and encapsulant solutions for more than 50 years. Whether utilizing epoxy, silicone or urethane polymer systems, we continue to deliver results for demanding applications in a wide variety of industries including automotive, energy, medical, aerospace, telecommunications and industrial electronics based on our customers' design and specification needs.

Our products offer can be used for electronic assembly of ignition coils, printed circuit boards, engine control modules, transmission control modules, sensors, power supplies, transformers and other critical electronic equipment. Our encapsulation and potting materials protect fragile electronic components from shock and vibration. Research shows a potting or encapsulation process using a high thermal conductivity material can dramatically decrease the operating temperature of an electric machine at a given load- our potting compounds can assist in lower operating temperatures which keep electronics running more efficiently. Our potting and encapsulation compounds can also help extend the life of most electronics.

If you need help choosing one of our standard potting and encapsulant products or if you need a custom material to meet your needs, let us help you determine an appropriate solution for your application. Our application engineers can also help guide you through the potting process to figure out the best method for your application.

 

Silicone products are widely known to protect fragile electronic components and modules where flame and high temperature resistance and permanent flexibility are among the top priorities.

Silicones

Silicones are one of the most versatile chemistries and offer inherent flexibility spanning over a wide temperature range (-75°C to +200°C). Silicone products are widely known to protect fragile electronic components and modules where flame and high temperature resistance and permanent flexibility are among the top priorities. Our offerings include platinum-cured, soft silicone and condensation-cured silicone rubbers, either unfilled clear or filled.

 

Epoxies provide strength, versatility, durability, adhesion, chemical resistance and high temperature tolerance in adhesive, potting and encapsulant applications.

Epoxies

Epoxies provide strength, versatility, durability, adhesion, chemical resistance and high temperature tolerance in adhesive, potting and encapsulant applications. These products can be formulated to fit a variety of applications and requirements thanks to the wide availability of raw materials. We offer a wide range of epoxy products from extremely flexible to highly-rigid casting materials, either filled or unfilled, that are thermally and/or electrically conductive and flame retardant.

 

For electronic packaging, urethanes are known to work best in low-temperature applications. They protect stress-sensitive electronic devices and act as a barrier against water.

Urethanes

Urethanes are considered to be a great alternative to silicones when high temperature resistance is not required. For electronic packaging, urethanes are known to work best in low-temperature applications. They protect stress-sensitive electronic devices and act as a barrier against water. We offer low viscosity urethane products ranging from soft gels to semi-rigid casting materials that are designed to fit various potting application needs.

 

Thermally Conductive Potting & Encapsulation Materials

Our CoolTherm® encapsulant and potting solutions provide a robust thermal management interface resulting in a more reliable product for you and your customers. Our solutions improve performance by optimizing heat dissipation with high thermal conductivity and low viscosity. They also protect your electronics by providing protection from dust, moisture and vibration as well as reducing component stress by exhibiting low shrinkage upon curing.

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