Semiconductor Packaging

Our die attach materials bond components to lead frames, or directly to interposer and other substrates. This product line offers many solutions depensing on your needs for mechanical strength, electrical conductivity and heat dissipation. Common packages that use die attach adhesives are: dual in-line (DIP), small-outline integrated-circuit (SOIC), quad flat pack (QFP) and chip-on board (COB). These adhesives can be dispensed, printed or applied by pin transfer in a variety of patterns.

Our capillary underfill encapsulants are high purity, semiconductor grade epoxies developed for the encapsulation of flip chip devices, chip-scale package (CSP) and ball grid array (BGA) components.. They are formulated for low standoff and fine pitch interconnections to enhance reliabilitties of drop and temperature cycle. These materials are engineered to withstand 260°C peak reflow temperatures of lead-free solders.

Greases are designed for applications where a thermal interface material is required and where the heat sink may later need to be easily removed from the device. The thixotropic character or these greases hold the heat sink in place until it can be mechanically attached. Our greases can be used with a variety of devices including flip chip microprocessors, plastic pin-grade arrays (PPGAs), ball grid arrays (BGAs), microBGAs, digital signal processing chips (DSP), graphic accelerator chips, and high-speed memory devices.