Our die attach materials bond components to lead frames, or directly to the interposer and other substrates. This product line offers many solutions depending on your needs for mechanical strength, electrical conductivity, and heat dissipation. Common packages that use die attach adhesives are: dual-in-line (DIP), small-outline integrated-circuit (SOIC), quad flat pack (QFP), and chip-on-board (COB). These adhesives can be dispensed, printed, or applied by pin transfer in a variety of patterns.