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LORD Corporation

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Semiconductor Packaging and Circuit Assembly Products Electronics Blog

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Product Viscosity Mixed Viscosity Cure Time Thermal Conductivity Glass Transition Temperature (Tg) Technical Data Sheets MSDS (US)
Circalok™ 6960 Conductive Adhesive 150,000 1.1 49 Download Download
Circalok™ 6968 Conductive Adhesive 250,000 250,000 1.2 Download Download
Circalok™ 6972 Conductive Adhesive Download
Gelease ® MG-120 Thermally Conductive Gel

400,000

60 min @ 120°C; or
30 min @ 150°C

2.8 -121 Download Download
Gelease ® MG-121 Thermally Conducive Gel

60,500

2.3 -121 Download Download
Gelease ® MG-122 Thermally Conductive Gel

60,000

2.8 -121 Download Download
Gelease ® MG-133 Thermally Conductive Gel

128,400

3.6 -110 Download
Thermoset MA-420 Epoxy Adhesive

2,100,000

70 Download Download
Thermoset MA-511 Epoxy Adhesive/Sealant

300,000, 1 rpm
55,000, 10 rpm

0.28 70 Download Download
Thermoset MD-130 Adhesive

60,000

0.42 140 Download
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