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LORD Corporation

With more than 3,100 employees in 26 countries, 19 manufacturing facilities and 10 R&D centers worldwide, we're there for our customers.

Our Company

Semiconductor Packaging and Circuit Assembly Products

Showing 1 - 4 of 4
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Product Viscosity Mixed Viscosity Cure Time Thermal Conductivity Glass Transition Temperature (Tg) Technical Data Sheets MSDS (US)
CoolTherm ® ME-525 Underfill Encapsulant

6000

0.5

120

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CoolTherm ® ME-531 Underfill Encapsulant

4000

0.5

140

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CoolTherm ® ME-543 Underfill Encapsulant

21,000

1.2

135

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CoolTherm ® ME-555 Underfill Encapsulant

5500

0.5

125

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