Semiconductor packaging materials are materials used to assemble semiconductor packages and range from adhesives to encapsulants. Our surface mount and die attach adhesives are designed to enhance the assembly process and improve reliability. Our glob top, dam and underfill encapsulants provide environmental protection, reduce warpage, demonstrate excellent flow, offer good adhesion to multiple substrates and have the strength to handle over-molding and subsequent process steps.
LORD CoolTherm® thermal management materials are critical to the reliability of the semiconductor chip. Thermal interface materials are used to effectively transfer heat from the semiconductor chip or package to the heat sink or heat spreader and are available in adhesives, gap fillers, gels or greases. These materials offer a variety of thermal performances, dependent on the end use application.